JPH0241923B2 - - Google Patents

Info

Publication number
JPH0241923B2
JPH0241923B2 JP23436382A JP23436382A JPH0241923B2 JP H0241923 B2 JPH0241923 B2 JP H0241923B2 JP 23436382 A JP23436382 A JP 23436382A JP 23436382 A JP23436382 A JP 23436382A JP H0241923 B2 JPH0241923 B2 JP H0241923B2
Authority
JP
Japan
Prior art keywords
contact
mold
electrode plate
lead frame
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23436382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59125112A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP23436382A priority Critical patent/JPS59125112A/ja
Priority to CA000444220A priority patent/CA1214835A/en
Priority to US06/565,043 priority patent/US4532451A/en
Publication of JPS59125112A publication Critical patent/JPS59125112A/ja
Publication of JPH0241923B2 publication Critical patent/JPH0241923B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Casings For Electric Apparatus (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP23436382A 1982-12-28 1982-12-29 端子一体形ケ−スの製造方法 Granted JPS59125112A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP23436382A JPS59125112A (ja) 1982-12-29 1982-12-29 端子一体形ケ−スの製造方法
CA000444220A CA1214835A (en) 1982-12-28 1983-12-23 Piezoelectric resonator
US06/565,043 US4532451A (en) 1982-12-28 1983-12-23 Terminals and mounting for piezoelectric resonators

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23436382A JPS59125112A (ja) 1982-12-29 1982-12-29 端子一体形ケ−スの製造方法

Publications (2)

Publication Number Publication Date
JPS59125112A JPS59125112A (ja) 1984-07-19
JPH0241923B2 true JPH0241923B2 (en]) 1990-09-20

Family

ID=16969828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23436382A Granted JPS59125112A (ja) 1982-12-28 1982-12-29 端子一体形ケ−スの製造方法

Country Status (1)

Country Link
JP (1) JPS59125112A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3072632B2 (ja) * 1988-10-03 2000-07-31 セイコーエプソン株式会社 圧電発振器

Also Published As

Publication number Publication date
JPS59125112A (ja) 1984-07-19

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